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  <front>
    <journal-meta>
      <journal-title-group><journal-title>SET Proceedings</journal-title></journal-title-group>
      <issn pub-type="epub">2978-4387</issn>
      <publisher><publisher-name>Caravel Press</publisher-name></publisher>
    </journal-meta>
    <article-meta>
      <article-id pub-id-type="doi">10.65582/set.2012.207</article-id>
      <article-id pub-id-type="publisher-id">2012.207</article-id>
      <title-group><article-title>Enhancement Cooling Performance of LED Packages with Carbon Nano Paste</article-title></title-group>
    <contrib-group>
      <contrib contrib-type="author">
        <name><surname>Nam</surname><given-names>Seong Rim</given-names></name>
        <xref ref-type="aff" rid="aff1"/>
      </contrib>
      <contrib contrib-type="author">
        <name><surname>Jung</surname><given-names>Chung Woo</given-names></name>
        <xref ref-type="aff" rid="aff1"/>
      </contrib>
      <contrib contrib-type="author">
        <name><surname>Kang</surname><given-names>Yong Tae</given-names></name>
        <xref ref-type="aff" rid="aff1"/>
      </contrib>
      <aff id="aff1">Department of Mechanical Engineering, Kyung Hee University Seochun-dong, Giheung-gu, Yongin-si, Gyeonggi-do, 446-701, Republic Korea</aff>
    </contrib-group>
      <pub-date publication-format="electronic" date-type="pub"><day>02</day><month>09</month><year>2012</year></pub-date>
      <volume>11</volume>
      <issue>1</issue>
      <isbn publication-format="electronic">978-1-995850-02-3</isbn>
      <fpage>1939</fpage>
      <lpage>1944</lpage>
      <self-uri xlink:href="https://caravelpress.com/proceedings/set/papers/2012.207"/>
      <history>
        <date date-type="received"><string-date>2 September 2012</string-date></date>
      </history>
      <permissions>
        <copyright-statement>© 2012 Copyright WSSET</copyright-statement>
        <copyright-year>2012</copyright-year>
      </permissions>
      <abstract><p>Light Emitting Diode (LED) technology has been developed rapidly in recent years in the area of illumination applications. However, the rate of heat generation increases with the LED illumination intensity. The LED chip temperature is critical to increase the LED lifetime. In this study confirm the possibility to apply the heat dissipation system, the thermal conductivities of the paste with carbon nano tubes (CNTs) are measured by the solid thermal conductivity measurement equipment. It is found that the measured thermal conductivities of the paste with CNTs enhance up to 80% compared with the pure one. It is finally confirmed that the carbon nano paste can be used for LED cooling application.</p></abstract>
      <conference>
        <conf-date>2 to 5 September 2012</conf-date>
        <conf-name>11th International Conference on Sustainable Energy Technologies</conf-name>
        <conf-acronym>SET2012</conf-acronym>
        <conf-num>11</conf-num>
        <conf-loc>Vancouver, Canada</conf-loc>
      </conference>
    </article-meta>
  </front>
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