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    <journal-meta>
      <journal-title-group><journal-title>SET Proceedings</journal-title></journal-title-group>
      <issn pub-type="epub">2978-4387</issn>
      <publisher><publisher-name>Caravel Press</publisher-name></publisher>
    </journal-meta>
    <article-meta>
      <article-id pub-id-type="doi">10.65582/set.2013.037</article-id>
      <article-id pub-id-type="publisher-id">2013.037</article-id>
      <title-group><article-title>A Study on the correlation between the thermal conductivity and air tightness of film materials employed in the manufacturing of VIPs.</article-title></title-group>
    <contrib-group>
      <contrib contrib-type="author">
        <name><surname>De Simon</surname><given-names>Lia</given-names></name>
        <xref ref-type="aff" rid="aff1"/>
      </contrib>
      <contrib contrib-type="author">
        <name><surname>Zheng</surname><given-names>Xiaofeng</given-names></name>
        <xref ref-type="aff" rid="aff1"/>
      </contrib>
      <contrib contrib-type="author" corresp="yes">
        <name><surname>Tetlow</surname><given-names>David</given-names></name>
        <xref ref-type="aff" rid="aff1"/>
        <email>david.tetlow@nottingham.ac.uk</email>
      </contrib>
      <contrib contrib-type="author">
        <name><surname>Riffat</surname><given-names>Saffa</given-names></name>
        <xref ref-type="aff" rid="aff1"/>
      </contrib>
      <contrib contrib-type="author">
        <name><surname>Gan</surname><given-names>Guohui</given-names></name>
        <xref ref-type="aff" rid="aff1"/>
      </contrib>
      <aff id="aff1">Dept of Architecture and the Built Environment, University of Nottingham, University Park, Nottingham, UK, NG7 2RD, UK</aff>
    </contrib-group>
      <pub-date publication-format="electronic" date-type="pub"><day>26</day><month>08</month><year>2013</year></pub-date>
      <volume>12</volume>
      <issue>1</issue>
      <isbn publication-format="electronic">9789881543950</isbn>
      <fpage>357</fpage>
      <lpage>362</lpage>
      <self-uri xlink:href="https://caravelpress.com/proceedings/set/papers/2013.037"/>
      <history>
        <date date-type="received"><string-date>26 August 2013</string-date></date>
      </history>
      <permissions>
        <copyright-statement>© 2013 Copyright WSSET</copyright-statement>
        <copyright-year>2013</copyright-year>
      </permissions>
      <abstract><p>Currently the UK domestic buildings are responsible for approximately 15% of the total UK CO2 emissions. In a context where the Government set high emission reduction targets it is becoming essential to tackle the problem of GHG produced by existing dwellings. The most efficient solution to reduce the household emissions is to improve the efficiency of the building envelope by integrating insulation in the edifice construction. Up to now the major insulation strategy used to upgrade the British houses was cavity wall insulation but approximately one third of the existing dwellings cannot benefit from this tactic because it is built with solid walls. The remaining alternatives are represented by external wall insulation (EWI) or internal wall insulation (IWI). Both strategies present many barriers but one of the most outstanding is that, especially for IWI, the insulation layer will reduce the indoor space with heavy impact on window area and floor area. For this reason new insulating materials with lower thermal conductivity are being researched and developed. One of these innovative technologies is Vacuum Insulation Panels (VIP). These consist of an evacuated fumed silica core wrapped in an air tight film material that prevents air infiltration. While the core has been extensively studied and the fumed silica results show it to be the best available material to constitute this, there are still some issues regarding the film. The most efficient barriers are integrated with a layer of aluminium, but as a side effect this produces a thermal bridge, with consequent heat loss through the panel edge due to the high thermal conductivity of the metal mentioned. Decreasing the amount of aluminium in the envelope will reduce its thermal conductivity; however, at the same time it reduces the envelope air tightness. This is an unfavorable circumstance as it adversely affects the lifespan of the panel. The aim of this paper is to simulate with ANSYS 14.5 a metallized film envelope and quantify the edge effect caused by the metal coatings. A model that can be used to compare the edge effect of different films will be developed.</p></abstract>
      <kwd-group kwd-group-type="author">
        <kwd>VIPs</kwd>
        <kwd>Retrofit</kwd>
        <kwd>ANSYS</kwd>
        <kwd>Edge Effect</kwd>
      </kwd-group>
      <conference>
        <conf-date>26 to 29 August 2013</conf-date>
        <conf-name>12th International Conference on Sustainable Energy Technologies</conf-name>
        <conf-acronym>SET2013</conf-acronym>
        <conf-num>12</conf-num>
        <conf-loc>Hong Kong, China</conf-loc>
      </conference>
    </article-meta>
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