Heating due to continuous operation in electronic devices is a common problem. Especially the decrease in the size of the devices produced with new possibilities makes this situation more complicated. Although it is possible for medium and large-sized devices to predominantly use forced convection for cooling, this is not possible as device sizes get smaller. In this case, the use of expanded surfaces is common. With the application called fin, the surface area for heat dissipation is expanded and more heat is removed from the device. In this study, the effect of the use of aluminium, brass, and iron on parabolic fin performance in an unconventional parabolic fin application is discussed with the CFD model created. Recommendations are made to the manufacturers by interpreting how the change in material properties affected the heat discharge.