CFD analysis of the effect of rectangular groove structure on heat transfer in parabolic fins

With the technological developments, the increasing use of electronic devices has reached an incredible point. The constant use of these devices, which we do not keep with us in our daily life, causes a decrease in performance due to heating and heating in electronic devices. To eliminate this situation, the use of refrigeration equipment is inevitable. In small-scale electronic devices, forced convection is predominant because cooling cannot be provided with sufficient surface area. However, the reduction in device dimensions makes it difficult to integrate forced transport equipment. Therefore, this problem is tried to be solved by using enlarged surfaces. In this study, the effect of the rectangular groove structure on the heat transfer for the non-traditional parabolic fin, which is one of the fin structures used in electronic devices, is evaluated with the CFD model. The effect of the increase in the number of rectangular grooves on the heat dissipation is examined and the optimum situation is tried to be obtained. For a convection coefficient of 10 W/m2K at 400 K fin bottom temperature and 300 K ambient temperature, the heat dissipation is 0.267 W/cm3 in the non-grooved parabolic fin in the reference case, while this value increases by 90% to 0.507 W/cm3 in the 5-groovee parabolic fin. It is also seen that increasing the convection coefficient increases the heat dissipation but decreases the efficiency in any case. It is concluded that the number of grooves should be increased, and the convection coefficient should be high in order to obtain surfaces at lower temperatures.